S9S08SG16E1CTLR NXP Semiconductors IC MCU 8BIT 16KB FLASH 28TSSOP

2023/11/23 138

CATALOG

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Thailand

Data Bus Width (bit)	8
Family Name	S08
Device Core	S08
Instruction Set Architecture	CISC
Maximum Clock Rate (MHz)	40
Program Memory Type	Flash
Program Memory Size	16KB
RAM Size	1KB
Maximum Expanded Memory Size	64KB
Maximum CPU Frequency (MHz)	40
Number of Programmable I/Os	22
Number of Timers	1
ADC Channels	16
ADC Resolution (bit)	10
Core Architecture	S08
Number of ADCs	Single
PWM	2
Watchdog	1
Analog Comparators	1
Parallel Master Port	No
Real Time Clock	No
Timers Channels	1/2/2
Timers Resolution (bit)	8/8/16
Interface Type	I2C/SCI/SPI
Programmability	Yes
SPI	1
I2C	1
I2S	0
UART	0
USART	0
CAN	0
USB	0
Ethernet	0
Minimum Operating Supply Voltage (V)	2.7
Typical Operating Supply Voltage (V)	3.3\|5
Maximum Operating Supply Voltage (V)	5.5
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Supplier Temperature Grade	Automotive
Operating Supply Voltage (V)	3.3\|5
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-55

Supplier Package	TSSOP
Basic Package Type	Lead-Frame SMT
Pin Count	28
Lead Shape	Gull-wing
PCB	28
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	9.8(Max)
Package Width (mm)	4.5(Max)
Package Height (mm)	1.05(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	9.8(Max)
Package Overall Width (mm)	6.4
Package Overall Height (mm)	1.2(Max)
Seated Plane Height (mm)	1.2(Max)
Mounting	Surface Mount
Package Weight (g)	0.11495
Package Material	Plastic
Package Description	Thin Shrink Small Outline Package
Package Family Name	SO
Jedec	MO-153AE
Package Outline	Link to Datasheet

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	40
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu Alloy