R5F21238DFP#U0 Renesas Electronics IC MCU 16BIT 64KB FLASH 48LFQFP

label:
2023/11/23 131



CATALOG
R5F21238DFP#U0 COUNTRY OF ORIGIN
R5F21238DFP#U0 LIFECYCLE
R5F21238DFP#U0 PARAMETRIC INFO
R5F21238DFP#U0 PACKAGE INFO
R5F21238DFP#U0 MANUFACTURING INFO
R5F21238DFP#U0 PACKAGING INFO
R5F21238DFP#U0 ECAD MODELS


COUNTRY OF ORIGIN
China
Japan


LIFECYCLE
Obsolete
Dec 17,2021


PARAMETRIC INFO
Data Bus Width (bit) 16
Family Name R8C
Device Core R8C
Instruction Set Architecture CISC
Maximum Clock Rate (MHz) 20
Program Memory Type Flash
Program Memory Size 64KB
RAM Size 3KB
Maximum Expanded Memory Size 1MB
Data Memory Size 2KB
Maximum CPU Frequency (MHz) 20
Number of Programmable I/Os 41
Number of Timers 5
ADC Channels 12
ADC Resolution (bit) 10
LIN 1
Number of Cores 1
Core Architecture R8C
Number of ADCs Single
Watchdog 1
Interface Type I2C/LIN/UART
Programmability Yes
SPI 0
I2C 1
I2S 0
UART 2
USART 0
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 300
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Operating Supply Voltage (V) 3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LFQFP
Basic Package Type Lead-Frame SMT
Pin Count 48
Lead Shape Gull-wing
PCB 48
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 7
Package Width (mm) 7
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 9
Package Overall Width (mm) 9
Package Overall Height (mm) 1.7(Max)
Seated Plane Height (mm) 1.7(Max)
Mounting Surface Mount
Package Weight (g) 0.2
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BBC
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnBi|SnCu
Under Plating Material N/A
Terminal Base Material Cu Alloy|FeNi Alloy


PACKAGING INFO
Packaging Tray


ECAD MODELS

Produkt RFQ