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• High Current Capability |
• Low Stored Charge, Majority Carrier Conduction |
• Low Power Loss/High Efficiency |
• Highly Stable Oxide Passivated Junction |
• Guard−Ring for Stress Protection |
• Low Forward Voltage |
• High Surge Capacity |
• These are Pb−Free Devices* |
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CATALOG |
80SQ045NG COUNTRY OF ORIGIN |
80SQ045NG PARAMETRIC INFO |
80SQ045NG PACKAGE INFO |
80SQ045NG MANUFACTURING INFO |
80SQ045NG PACKAGING INFO |
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COUNTRY OF ORIGIN |
Malaysia |
China |
United States of America |
Philippines |
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PARAMETRIC INFO |
Type |
Schottky Diode |
Configuration |
Single |
Peak Reverse Repetitive Voltage (V) |
45 |
Maximum DC Reverse Voltage (V) |
45 |
Maximum Continuous Forward Current (A) |
8 |
Process Technology |
Bipolar |
Peak Forward Voltage (V) |
0.55 |
Peak Non-Repetitive Surge Current (A) |
140 |
Peak Reverse Current (uA) |
1000 |
Operating Junction Temperature (°C) |
-65 to 125 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
125 |
Minimum Operating Temperature (°C) |
-65 |
Maximum Operating Temperature (°C) |
125 |
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PACKAGE INFO |
Supplier Package |
DO-201AD |
Basic Package Type |
Through Hole |
Pin Count |
2 |
Lead Shape |
Through Hole |
PCB |
2 |
Tab |
N/R |
Pin Pitch (mm) |
N/R |
Package Length (mm) |
9.5(Max) |
Package Width (mm) |
N/R |
Package Height (mm) |
N/R |
Package Diameter (mm) |
5.3(Max) |
Seated Plane Height (mm) |
5.3(Max) |
Mounting |
Through Hole |
Package Weight (g) |
110 |
Package Material |
Plastic |
Package Description |
Axial Lead Package |
Package Family Name |
DO |
Jedec |
DO-201-AD |
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MANUFACTURING INFO |
MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/R |
Reflow Solder Time (Sec) |
N/R |
Maximum Wave Temperature (°C) |
220 |
Wave Solder Time (Sec) |
10 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu |
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PACKAGING INFO |
Packaging |
Bag |
Quantity Of Packaging |
500 |
Packaging Document |
Link to Datasheet |
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